Unleashing the Potential: Electronic Board-Level Underfill and Encapsulation Materials Market Projected to Reach US$526.3 Million by 2033 – A Report by Persistence Market Research
Global Market Study on Electronic Board Level Underfill and Encapsulation Material: Rapid Growth of Electronics Industry Fuelling Demand New York, Sept. 15, 2023 (GLOBE NEWSWIRE) — Electronic board-level underfill and encapsulating material sales were projected to reach a value of around US$ 310.7 million by the end of 2022. The market is projected to develop…