Welcome to the Future of Advanced Packaging Simulation
Discover the Latest Technology at the Design Automation Conference
Xpeedic Unveils Revolutionary SI/PI Suite
Are you ready to step into the future of advanced packaging simulation? Look no further than Xpeedic’s latest high-speed digital signal integrity and power integrity (SI/PI) suite, launched at the Design Automation Conference. This cutting-edge technology is set to revolutionize the way we approach SI/PI simulation for advanced packaging.
With features such as 2.5/3DIC SI/PI simulation, 3D EM simulation, SI/PI and multiphysics analysis, and high-speed system simulation, Xpeedic’s suite is a game-changer in the industry. Imagine being able to accurately predict and analyze signal and power integrity in your designs, ensuring optimal performance and reliability.
Continuous demonstrations are being held at Booth #1435 at the Design Automation Conference in San Francisco. Don’t miss your chance to experience the future of advanced packaging simulation firsthand.
How Will This Impact Me?
As a designer or engineer working in the field of advanced packaging, Xpeedic’s SI/PI suite will revolutionize your workflow. With more accurate and efficient simulation capabilities, you can ensure the success of your designs and reduce time-to-market. Say goodbye to costly rework and testing cycles, and hello to streamlined design processes.
How Will This Impact the World?
On a larger scale, the impact of Xpeedic’s SI/PI suite on the world of advanced packaging cannot be understated. As technology continues to advance at a rapid pace, the need for reliable and efficient simulation tools becomes increasingly crucial. By pushing the boundaries of SI/PI simulation capabilities, Xpeedic is paving the way for new innovations and breakthroughs in the field of advanced packaging.
Conclusion
With the launch of Xpeedic’s high-speed digital signal integrity and power integrity suite, the future of advanced packaging simulation is here. This revolutionary technology is set to transform the way we approach SI/PI simulation and analysis, offering unparalleled accuracy and efficiency. Don’t miss your chance to experience the next generation of advanced packaging simulation at the Design Automation Conference.
