Applied Materials Unveils Innovative Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Applied Materials, Inc. Plans to Accelerate Advanced Chip Packaging Technologies SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) — Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened…